System and method for controlling electroplating

ABSTRACT

Disclosed herein is a system and method for controlling electroplating, the method including: measuring current applied to an object to be plated at the time of electroplating, by a current sensor; receiving current data corresponding to the current applied to the object to be plated at the time of electroplating to execute necessary processing, and transmitting the processed current data to the HMI, by the measurement system; receiving the current data from the measurement system to execute necessary processing, and transmitting the processed data to the PLC, by the HMI; receiving the data from the HMI and storing the data in a memory, and then comparing and computing the stored current measurement value and a set current value, to control an output of the rectifier, by the PLC; and controlling the current supplied to the electroplating bath according to the control of the PLC, by the rectifier.

CROSS REFERENCE(S) TO RELATED APPLICATIONS

This application claims the benefit under 35 U.S.C. Section 119 of Korean Patent Application Serial No. 10-2012-0122150, entitled “System and Method for Controlling Electroplating” filed on Oct. 31, 2012, which is hereby incorporated by reference in its entirety into this application.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to a system and a method for controlling electroplating, and more particularly, to a system and a method for controlling electroplating, capable of allowing a product to be plated with a uniform thickness.

2. Description of the Related Art

Today, market trends of domestic and international printed circuit board (PCB) industries are changing day by day. The change types of the PCB industries are focusing on high integration, flexibility, and greening, such as reducing environmental materials, for example, lead (Pb) and the like. In characteristics of these changes of the PCB industries, the PCB is highly multilayered and highly integrated, and thus the layers of the substrate become thicker on from one surface or both surfaces or multilayers. There are several essential technologies in the PCB manufacturing method, but a plating technology for forming a high-integration circuit becomes a main essential technology. Currently, the plating technology for connecting layers and forming circuits is a generic technology in the manufacture of PCB.

In particular, in electroplating, the deviation in plating thickness is generated due to several factors such as intensity of current, variation in current, mechanical design, chemical reactions, and the like, which may cause several defects such as under-etching, over-etching, and the like in the subsequent process, a circuit process. Therefore, various attempts for obtaining uniform plating thickness have been made.

RELATED ART DOCUMENT Patent Documents (Patent Document 1) Korean Laid-Open Patent Publication No. 10-2002-0091911 (Patent Document 2) Korean Laid-Open Patent Publication No. 10-2001-0107788 SUMMARY OF THE INVENTION

An object of the present invention is to provide a system and a method for controlling electroplating, capable of allowing a product (PCB) to be plated with a uniform thickness, by measuring current intensity applied to the product at the time of plating and then controlling the current supplied to the electrolytic copper (electroplating bath) based on the measured current intensity.

According to an exemplary embodiment of the present invention, there is provided a system for controlling electroplating, the system including: an electroplating bath for performing electroplating on an object to be plated therein, the electroplating bath having a current sensor installed at one side of a body thereof, the current sensor measuring a current applied to the object to be plated at the time of electroplating; a measurement system receiving current data corresponding to the current applied to the object to be plated at the time of electroplating, which are measured by the current sensor, from the electroplating bath to execute necessary processing, and transmitting the processed current data to a subsequent apparatus; a human machine interface (HMI) receiving the current data applied to the object to be plated at the time of electroplating, from the measurement system, to execute necessary processing, and transmitting the processed data to a subsequent apparatus; a programmable logic controller (PLC) receiving the data from the HMI and storing the data in a memory, and comparing and computing the stored current measurement value and a set current value of a rectifier to control an output of the rectifier; and a rectifier controlling the current supplied to the electroplating bath according to the control of the PLC.

The electroplating bath and the measurement system may be configured to perform data transmission and reception therebetween through wireless communication.

The wireless communication may be Zigbee.

The measurement system and the HMI may be configured to perform data transmission and reception therebetween through OLE for process control (OPC) communication.

Here, for the OLE for process control (OPC) communication between the measurement system and the HMI, the measurement system may be defined as an OPC client and the HMI may be defined as an OPC server.

Here, for the OLE for process control (OPC) communication between the measurement system and the HMI, an OPC distributed component object model (DCOM) may be set.

The OPC DCOM may include security configurating, access permissions setting, firewall setting, password setting, and OPC port additive setting.

The HMI and the PLC may be configured to perform data transmission and reception therebetween through Ethernet communication.

According to another exemplary embodiment of the present invention, there is provided a method for controlling electroplating by a system for controlling electroplating including an electroplating bath, a measurement system, a human machine interface (HMI), a programmable logic controller (PLC), and a rectifier, the method including: a) measuring current applied to an object to be plated at the time of electroplating, by a current sensor installed at the electroplating bath; b) receiving current data corresponding to the current applied to the object to be plated at the time of electroplating, which are measured by the current sensor, to execute necessary processing, and transmitting the processed current data to the HMI, by the measurement system; c) receiving the current data applied to the object to be plated at the time of electroplating, from the measurement system, to execute necessary processing, and transmitting the processed data to the PLC, by the HMI; d) receiving the data from the HMI and storing the data in a memory, and then comparing and computing the stored current measurement value and a set current value of the rectifier, to control an output of the rectifier, by the PLC; and e) controlling the current supplied to the electroplating bath according to the control of the PLC, by the rectifier.

The electroplating bath and the measurement system may be configured to perform data transmission and reception therebetween through wireless communication.

The wireless communication may be Zigbee.

The measurement system and the HMI may be configured to perform data transmission and reception therebetween through OLE for process control (OPC) communication.

Here, for the OLE for process control (OPC) communication between the measurement system and the HMI, the measurement system may be defined as an OPC client and the HMI may be defined as an OPC server.

Here, for the OLE for process control (OPC) communication between the measurement system and the HMI, an OPC distributed component object model (DCOM) may be set.

The OPC DCOM may include security configurating, access permissions setting, firewall setting, password setting, and OPC port additive setting.

The HMI and the PLC may be configured to perform data transmission and reception therebetween through Ethernet communication.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram showing a constitution of a system for controlling electroplating according to an exemplary embodiment of the present invention; and

FIG. 2 is a flow chart showing a method for controlling electroplating according to the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Terms and words used in the present specification and claims are not to be construed as a general or dictionary meaning but are to be construed to have meaning and concepts meeting the technical ideas of the present invention based on a principle that the inventors can appropriately define the concepts of the terms in order to describe their own inventions in the best mode.

Through the specification, unless explicitly described to the contrary, the word “comprise” and variations such as “comprises” or “comprising”, will be understood to imply the inclusion of stated elements but not the exclusion of any other elements. In addition, the terms “-er”, “-or”, “module”, and “unit” described in the specification mean units for processing at least one function and operation, and can be implemented by hardware components or software components and combinations thereof.

Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram showing a constitution of a system for controlling electroplating according to an exemplary embodiment of the present invention.

Referring to FIG. 1, a system for controlling electroplating according to an exemplary embodiment of the present invention may include an electroplating bath 110, a measurement system 120, a human machine interface (HMI) 130, a programmable logic controller 140, and a rectifier 150.

In the electroplating bath 110, electroplating is performed on an object to be plated (for example, PCB) 116. A current sensor 114 is installed at one side of a body of the electroplating bath 110 to measure a current applied to the object to be plated 116 at the time of electroplating. That is, the electroplating bath 110 is filled with an electrolytic liquid for electroplating. Electroplating is performed while a plurality of objects to be plated (PCBs) 116 fixed on a hanger 112 are immersed in the electrolytic liquid. The current sensor 114 for measuring the current at the time of plating is installed at a predetermined portion of the hanger 112.

The measurement system 120 receives data, which correspond to the current applied to the object to be plated (PCB) 116 at the time of electroplating and are measured by the current sensor 114, from the electroplating bath 110 (that is, the current sensor 114 installed at the hanger 112 within the electroplating bath 110) to execute necessary processing, and transmits the processed data to a subsequent apparatus (herein, the HMI 130). Here, data transmission and reception between the measurement system 120 and the electroplating bath 110 may be performed through wireless communication. Here, as the wireless communication, Zigbee may be used.

The human machine interface (HMI) 130 receives current data, which are applied to the object to be plated (PCB) 116 at the time of electroplating, through the measurement system 120 to execute necessary processing, and transmits the processed data to a subsequent apparatus (herein, the PLC 140). Here, as the HMI 130, a general PC may be used.

In addition, data transmission and reception between the measurement system 120 and the HMI 130 may be performed through an OLE for process control (OPC) communication. Here, the OPC communication is a single communication interface for performing communication between various applications.

In addition, for OPC communication between the measurement system 120 and the HMI 130, the measurement system 120 may be designated as an OPC client and the HMI 130 may be designated as an OPC server when communication is performed.

Here, an OPC distributed component object model (DCOM) may be set for the OPC communication between the measurement system 120 and the HMI 130.

In addition, here, security configurating, access permissions setting, firewall setting, password setting, OPC port additive setting may be set in the OPC DCOM.

Meanwhile, the PLC 140 receives data from the HMI 130 and stores the data in a memory (not shown), and compares and computes the stored current measurement value and the set current value of the rectifier 150 to control an output of the rectifier 150.

Here, data transmission and reception between the HMI 130 and the PLC 140 may be performed through Ethernet communication.

The rectifier 150 controls the current supplied to the electroplating bath 110 according to the control of the PLC 140.

Then, a method for controlling electroplating by the system for controlling electroplating according to the present invention having the above constitution will be described.

FIG. 2 is a flow chart showing a method for controlling electroplating according to the present invention.

Referring to FIG. 2, the method for controlling electroplating according to the present invention is a method for controlling electroplating carried out by the system for controlling electroplating, including the electroplating bath 110, the measurement system 120, the HMI 130, the PLC 140, and the rectifier 150. First, the current sensor 114 installed at the electroplating bath 110 measures the current applied to the object to be plated (PCB) 116 at the time of electroplating (S201).

Then, the measurement system 120 receives data corresponding to the current applied to the object to be plated at the time of electroplating, which are measured by the current sensor 114, to execute necessary processing, and then transmits the processed data to the HMI 130 (S202).

Then, the human machine interface (HMI) 130 receives current data, which are applied to the object to be plated (PCB) 116 at the time of electroplating, through the measurement system 120 to execute necessary processing, and transmits the processed data to the PLC 140 (S203).

Then, the PLC 140 receives data from the HMI 130 and stores the data in a memory (not shown), and compares and computes the stored current measurement value and the set current value of the rectifier 150 to control an output of the rectifier 150 (S204). That is, the PLC 140 compares and computes the set current value of the rectifier 150 and the current value measured by the measurement system 120. Then, the output of the rectifier 150 is controlled in a manner, such as +1 A, +2 A, +3 A, −1 A, −2 A, and −3 A, by a difference between the current measurement value and the set current value. Here, the output of the rectifier 150 is controlled until the current measurement value is equal to the set current value.

After that, the rectifier 150 controls the current supplied to the electroplating bath 110 according to the control of the PLC 140 (S205).

In the series procedure as above, data transmission and reception between the electroplating bath 110 and the measurement system 120 may be performed through wireless communication. Here, as the wireless communication, Zigbee may be used.

In addition, data transmission and reception between the measurement system 120 and the HMI 130 may be performed through an OLE for process control (OPC) communication.

Here, for the OPC communication between the measurement system 120 and the HMI 130, the measurement system 120 may be designated as an OPC client and the HMI 130 may be designated as an OPC server when communication is performed.

Here, an OPC distributed component object model (DCOM) may be set for the OPC communication between the measurement system 120 and the HMI 130.

Here, security configurating, access permissions setting, firewall setting, password setting, and OPC port additive setting may be set in the OPC DCOM.

In addition, data transmission and reception between the HMI 130 and the PLC 140 may be performed through Ethernet communication.

Here, with respect to the OPC communication employed in the present invention, communication mechanism between the measurement system 120 and the HMI 130 will be described.

As described above, the OPC distributed component object model (DCOM) is set for the OPC communication between the measurement system 120 and the HMI 130. When security configurating, access permissions setting, firewall setting, password setting, and OPC port additive setting were completed with respect to the OPC DCOM setting, communication is executed by using a communication tag according to a tag naming rule previously discussed. Here, tag transmission between the measurement system 120 and the HMI 130 using the current sensor 114 is exemplified.

Tags necessary for communication are largely classified into four types, Tag M, Tag E, Tag A, and Tag C.

First, Tag C is an abbreviation of “connection”, and is a tag for checking the communication connection state between two equipments. A certain value is continuously written from the measurement system 120 to the HMI 130. It is determined that the OPC communication is disconnected if the certain value is not changed for 10 seconds or longer.

Tag A is an abbreviation of “alarm”, and is a tag for generating or canceling alarm when the OPC communication is disconnected.

Tag E is an abbreviation of “event”, and is a tag for transmitting data about product LOT ID and hanger No., from the HMI 130 to the measurement system 120.

In addition, Tag M is a parameter-related tag, and a tag for periodically transmitting data.

The measurement system 120 implements tag transmission to the HMI 130 by using Tag M including the current value measured by the current sensor 114 in addition to data of Tag E (Product LOT ID, hanger No.).

Here, a substantial example of transmission with respect to the respective tags will be described.

As described above, Tag M is a parameter-related tag, and a tag for periodically transmitting data.

Ex) tag transmission example: M_(—)003_(—)000002_(—)00-FFA393949;35

(Current value at Clamp No. 003 of Hanger No. 2 is 35 A and Product LOT No. is FFA393949)

Tag E includes hanger number and product LOT ID, and the HMI 130 implements tag transmission thereof to the measurement system 120 at the same time when the product (PCB) is input.

Ex) tag transmission example: E_(—)000_(—)0000001_(—)00-163030;H_(—)001;F394549439

(Hanger H_(—)001 enters the electroplating bath and Product LOT ID under working is F394549439, at 16:30:30)

Tag A is a tag for generating or canceling alarm for communication between the measurement system 120 and the HMI 130.

Ex) tag transmission example: A_(—)000_(—)000000_(—)01

(Alarm generation A_(—)000_(—)000000_(—)02: alarm cancellation)

Tag C is a tag for checking the connection state between the measurement system 120 and the HMI 130.

A certain value is continuously written in the HMI 130. If the certain value is not changed for 10 seconds or longer, the communication is determined to be disconnected.

Ex) C_(—)000_(—)000001_(—)00→86685, write a certain value

As described above, in the present invention, four types of tags such as, tag M, tag E, tag A, and tag C are used for the OPC communication.

As described above, the system and the method for controlling electroplating according to the present invention, the current applied to the object to be plated (PCB) at the time of electroplating is measured, and is fed-back to the rectifier, and then based on this, the rectifier controls and controls the current to the plating bath, so that the object to be plated can be plated with a uniform thickness.

As set forth above, according to the present invention, the current applied to the object to be plated (PCB) at the time of electroplating is measured, and is fed-back to the rectifier, and then based on this, the rectifier controls the current supplied to the plating bath, so that the object to be plated can be plated with a uniform thickness.

Although the exemplary embodiments of the present invention have been disclosed for illustrative purposes, the present invention is not limited thereto, and it will be appreciated to those skilled in the art that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Therefore, the protection scope of the present invention must be construed by the following claims and it should be construed that all spirit within a scope equivalent thereto are included in the scope of the present invention. 

What is claimed is:
 1. A system for controlling electroplating, the system comprising: an electroplating bath for performing electroplating on an object to be plated therein, the electroplating bath having a current sensor installed at one side of a body thereof, the current sensor measuring a current applied to the object to be plated at the time of electroplating; a measurement system receiving current data corresponding to the current applied to the object to be plated at the time of electroplating, which are measured by the current sensor, from the electroplating bath to execute necessary processing, and transmitting the processed current data to a subsequent apparatus; a human machine interface (HMI) receiving the current data applied to the object to be plated at the time of electroplating, from the measurement system, to execute necessary processing, and transmitting the processed data to a subsequent apparatus; a programmable logic controller (PLC) receiving the data from the HMI and storing the data in a memory, and comparing and computing the stored current measurement value and a set current value of a rectifier to control an output of the rectifier; and a rectifier controlling the current supplied to the electroplating bath according to the control of the PLC.
 2. The system according to claim 1, wherein the electroplating bath and the measurement system are configured to perform data transmission and reception therebetween through wireless communication.
 3. The system according to claim 2, wherein the wireless communication is Zigbee.
 4. The system according to claim 1, wherein the measurement system and the HMI are configured to perform data transmission and reception therebetween through OLE for process control (OPC) communication.
 5. The system according to claim 4, wherein for the OLE for process control (OPC) communication between the measurement system and the HMI, the measurement system is defined as an OPC client and the HMI is defined as an OPC server.
 6. The system according to claim 4, wherein for the OLE for process control (OPC) communication between the measurement system and the HMI, an OPC distributed component object model (DCOM) is set.
 7. The system according to claim 6, wherein the OPC DCOM includes security configurating, access permissions setting, firewall setting, password setting, and OPC port additive setting.
 8. The system according to claim 1, wherein the HMI and the PLC are configured to perform data transmission and reception therebetween through Ethernet communication.
 9. A method for controlling electroplating by a system for controlling electroplating including an electroplating bath, a measurement system, a human machine interface (HMI), a programmable logic controller (PLC), and a rectifier, the method comprising: a) measuring current applied to an object to be plated at the time of electroplating, by a current sensor installed at the electroplating bath; b) receiving current data corresponding to the current applied to the object to be plated at the time of electroplating, which are measured by the current sensor, to execute necessary processing, and transmitting the processed current data to the HMI, by the measurement system; c) receiving the current data applied to the object to be plated at the time of electroplating, from the measurement system, to execute necessary processing, and transmitting the processed data to the PLC, by the HMI; d) receiving the data from the HMI and storing the data in a memory, and then comparing and computing the stored current measurement value and a set current value of the rectifier, to control an output of the rectifier, by the PLC; and e) controlling the current supplied to the electroplating bath according to the control of the PLC, by the rectifier.
 10. The method according to claim 9, wherein the electroplating bath and the measurement system are configured to perform data transmission and reception therebetween through wireless communication.
 11. The method according to claim 10, wherein the wireless communication is Zigbee.
 12. The method according to claim 9, wherein the measurement system and the HMI are configured to perform data transmission and reception therebetween through OLE for process control (OPC) communication.
 13. The method according to claim 12, wherein for the OLE for process control (OPC) communication between the measurement system and the HMI, the measurement system is defined as an OPC client and the HMI is defined as an OPC server.
 14. The method according to claim 12, wherein for the OLE for process control (OPC) communication between the measurement system and the HMI, an OPC distributed component object model (DCOM) is set.
 15. The method according to claim 14, wherein the OPC DCOM includes security configurating, access permissions setting, firewall setting, password setting, and OPC port additive setting.
 16. The method according to claim 9, wherein the HMI and the PLC are configured to perform data transmission and reception therebetween through Ethernet communication. 